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DMN4468LSS N-CHANNEL ENHANCEMENT MODE MOSFET Please click here to visit our online spice models database. Features * * * * * * * Low On-Resistance Low Input Capacitance Fast Switching Speed Low Input/Output Leakage Lead Free By Design/RoHS Compliant (Note 3) "Green" Device (Note 4) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data * * * * * * * Case: SOP-8L Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminal Connections: See Diagram Below Marking Information: See Page 4 Ordering Information: See Page 4 Weight: 0.072 grams (approximate) NEW PRODUCT S S S G TOP VIEW Internal Schematic D D D D TOP VIEW Maximum Ratings Drain-Source Voltage Gate-Source Voltage @TA = 25C unless otherwise specified Symbol VDSS VGSS Steady State TA = 25C TA = 70C ID IDM Value 30 20 10 9 50 Unit V V A A Characteristic Continuous Drain Current (Note 1) Pulsed Drain Current (Note 2) Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient @TA = 25C Operating and Storage Temperature Range Notes: Symbol PD RJA TJ, TSTG Max 1.52 82 -55 to +150 Unit W C/W C 1. Device mounted on FR-4 PCB with minimum recommended pad layout. 2. Repetitive rating, pulse width limited by junction temperature. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. DMN4468LSS Document number: DS31773 Rev. 3 - 2 1 of 6 www.diodes.com June 2009 (c) Diodes Incorporated DMN4468LSS Electrical Characteristics @TA = 25C unless otherwise specified Symbol BVDSS IDSS IGSS VGS(th) RDS (ON) |Yfs| VSD Ciss Coss Crss Rg Qg Qgs Qgd tD(on) tr tD(off) tf Min 30 1.05 15 8 0.73 867 85 81 1.39 18.85 2.59 6.15 5.46 14.53 18.84 6.01 20 0.95 Typ 11 Max 1.0 100 1.95 14 Unit V A nA V m S V pF pF pF nC nC nC ns ns ns ns Test Condition VGS = 0V, ID = 250A VDS = 30V, VGS = 0V VGS = 20V, VDS = 0V VDS = VGS, ID = 250A VGS = 10V, ID = 11.6A VGS = 4.5V, ID = 10A VDS = 5V, ID = 11.6A VGS = 0V, IS = 1A VDS =10V, VGS = 0V, f = 1.0MHz VDS =0V, VGS = 0V, f = 1MHz VGS =10V, VDS = 15V, ID =11.6A NEW PRODUCT Characteristic OFF CHARACTERISTICS (Note 5) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25C Gate-Source Leakage ON CHARACTERISTICS (Note 5) Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance Diode Forward Voltage DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Notes: VDD = 15V, VGS = 10V, RL = 1.3, RG = 3, ID = 1A 5. Short duration pulse test used to minimize self-heating effect. 30 VGS = 8.0V 30 VDS = 5V 25 ID, DRAIN CURRENT (A) VGS = 4.5V 25 ID, DRAIN CURRENT (A) 20 20 15 VGS = 3.0V 15 10 VGS = 2.8V 10 TA = 150C 5 0 0 1 VGS = 2.2V VGS = 2.5V 5 TA = 125C TA = 85C TA = 25C T A = -55C 0 5 2 3 4 VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 1 Typical Output Characteristic 1 1.5 2 2.5 3 VGS, GATE-SOURCE VOLTAGE (V) Fig. 2 Typical Transfer Characteristic 3.5 DMN4468LSS Document number: DS31773 Rev. 3 - 2 2 of 6 www.diodes.com June 2009 (c) Diodes Incorporated DMN4468LSS RDS(ON), DRAIN-SOURCE ON-RESISTANCE () RDS(ON), DRAIN-SOURCE ON-RESISTANCE () 0.04 0.04 VGS = 4.5V 0.03 0.03 TA = 150C TA = 125C NEW PRODUCT 0.02 VGS = 4.5V 0.02 TA = 85C TA = 25C 0.01 0.01 TA = -55C 0 0 5 10 15 20 25 ID, DRAIN-SOURCE CURRENT (A) Fig. 3 Typical On-Resistance vs. Drain Current and Gate Voltage 30 0 0 5 10 15 20 25 ID, DRAIN CURRENT (A) 30 Fig. 4 Typical On-Resistance vs. Drain Current and Temperature RDSON, DRAIN-SOURCE ON-RESISTANCE () 0.03 1.6 RDSON, DRAIN-SOURCE ON-RESISTANCE (NORMALIZED) 1.4 VGS = 4.5V ID = 10A 0.02 1.2 1.0 VGS = 4.5V ID = 10A VGS = 10V ID = 11.6A 0.01 0.8 VGS = 10V ID = 11.6A 0.6 -50 -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) 0 -50 -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) Fig. 5 On-Resistance Variation with Temperature Fig. 6 On-Resistance Variation with Temperature 2.4 VGS(TH), GATE THRESHOLD VOLTAGE (V) 20 2.0 16 IS, SOURCE CURRENT (A) TA = 25C 1.6 ID = 250A 12 1.2 ID = 1mA 8 0.8 4 0.4 -50 -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) Fig. 7 Gate Threshold Variation vs. Ambient Temperature 0 0.4 0.6 0.8 VSD, SOURCE-DRAIN VOLTAGE (V) Fig. 8 Diode Forward Voltage vs. Current 1 DMN4468LSS Document number: DS31773 Rev. 3 - 2 3 of 6 www.diodes.com June 2009 (c) Diodes Incorporated DMN4468LSS 10,000 f = 1MHz 10,000 IDSS, LEAKAGE CURRENT (nA) T A = 150C C, CAPACITANCE (pF) 1,000 T A = 125C 1,000 Ciss NEW PRODUCT 100 Coss 100 Crss 10 TA = 85C TA = 25C 10 0 5 10 15 20 25 VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 9 Typical Total Capacitance 30 1 0 TA = -55C 5 10 15 20 25 VDS, DRAIN-SOURCE VOLTAGE (V) 30 Fig. 10 Typical Leakage Current vs. Drain-Source Voltage 1 r(t), TRANSIENT THERMAL RESISTANCE D = 0.7 D = 0.5 D = 0.3 0.1 D = 0.1 D = 0.9 D = 0.05 RJA(t) = r(t) * RJA RJA = 83C/W P(pk) D = 0.02 0.01 D = 0.01 D = 0.005 t1 t2 T J - T A = P * R JA(t) Duty Cycle, D = t1/t2 D = Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 t1, PULSE DURATION TIME (s) Fig. 11 Transient Thermal Response 10 100 1,000 Ordering Information Part Number DMN4468LSS-13 Notes: (Note 6) Case SOP-8L Packaging 2500 / Tape & Reel 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information Top View 8 5 Logo N4468LS YY WW Part no. Week: 01 ~ 52 Year: "09" = 2009 1 4 DMN4468LSS Document number: DS31773 Rev. 3 - 2 4 of 6 www.diodes.com June 2009 (c) Diodes Incorporated DMN4468LSS Package Outline Dimensions E1 E A1 L Gauge Plane Seating Plane Detail `A' h 45 A2 A A3 e D b 7~9 Detail `A' SOP-8L Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm NEW PRODUCT Suggested Pad Layout X 0.254 C1 C2 Y Dimensions X Y C1 C2 Value (in mm) 0.60 1.55 5.4 1.27 DMN4468LSS Document number: DS31773 Rev. 3 - 2 5 of 6 www.diodes.com June 2009 (c) Diodes Incorporated DMN4468LSS IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDING TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. NEW PRODUCT Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2009, Diodes Incorporated www.diodes.com DMN4468LSS Document number: DS31773 Rev. 3 - 2 6 of 6 www.diodes.com June 2009 (c) Diodes Incorporated |
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